View BD62222HFP-TR_9090220.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

dc brush motor drivers (30v max ) bd62222hfp general description bd62222hfp is a full bridge driver for brush motor applications. this ic can operate at a wide range of power - supply voltages (from 6v to 27v) with output current s of up to 2.5a. mos transistors in the output stage allow pwm speed control. the bd62222hfp is pin compatib le with the bd623 x hfp series. features ? built - in one channel driver ? cross- conduction prevention circuit ? four protection circuits provided : ocp, ovp, tsd and uvlo application s vtr; cd/dvd player s; audio - visual equipment ; optical disc drive s; pc peripheral s; oa equipment s key specifications supply voltage range: 30 v(max) maximum output current: 2.5 a output on -resistance: 1.0 pwm input frequency range : 20 khz to 100khz standby current : 0a ( typ ) operating temperature r ange: - 40 c to +85 c package w(typ) x d(typ) x h( max ) hrp7 9.395mm x 10.540mm x 2.005mm ordering information b d 6 2 2 2 2 h f p - t r part n umber package packaging and forming specification tr: embossed tape and reel (hrp7) hfp : hrp7 lineup voltage rating ( max ) channels output current ( max ) package ordering par t number 30v 1ch 2.5a hrp7 reel of 2000 bd62222hfp - tr hrp7 (pd=1.60w) (note) pd : mo unted on a 70mm x 70mm x 1.6mm glass - epoxy board. product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 13 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. 09.sep.2014 rev.003 tsz22111 ? 14 ? 001 www.rohm.com datashee t downloaded from: http:///
data s heet bd62222hfp block diagram p in configuration p in d escrip tion s pin no. pin name function 1 vcc power supply 2 out1 driver output 3 fin control input (forward) 4 gnd ground 5 rin control input (reverse) 6 out2 driver output 7 vcc power supply fin gnd ground ( note ) use all vcc pin by the same voltage. (top view) vcc out1 fin gnd rin out2 vcc 7 6 2 3 5 ctrl protect fin rin vcc out1 out2 4 gnd 1 vcc fin gnd 2/ 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp absolute m aximum r atings (ta=25 c , all voltages are with respect to ground ) parameter symbol r ating unit supply voltage v cc 30 v output current i omax 2.5 (note 1) a all other input pins v in - 0.3 to v cc v operating temperature t opr - 40 to +85 c storage temperature tstg - 55 to +150 c power dissipation pd 1.6 (note 2) w junction temperature t jmax 150 c (note 1) do not exceed pd or aso. (note 2) hrp7 package. mounted on a 70mm x 70mm x 1.6mm glass - epoxy board. derate by 12.8mw/ c f o r ta above 25 c . caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is importa nt to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. rec ommended operating condition (ta=25c ) parameter symbol rating unit supply voltage v cc 6 to 27 v electrical c haracteristics (unless otherwise specified, ta=25 c and v cc =24v) parameter symbol limit unit conditions min typ m ax supply current i cc 0. 9 1.4 2.7 ma forward / reverse / brake stand - by current i stby - 0 10 a stand - by input high voltage v ih 2.0 - - v input low voltage v il - - 0.8 v input bias current i ih 30 50 100 a v in =5.0v output on -resistance r on 0.5 1.0 1.5 ? i o ut =1.0a, vertically total input frequency range f max 20 - 100 khz fin / rin 3/ 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp typical performance curves (reference data ) 0.0 0.2 0.4 0.6 0.8 1.0 0 6 12 18 24 30 input voltage: v in [v] input bias current: i ih [ma] 85c 25c -40c figure 4 . input bias current vs input voltage input voltage : v in [v] input bias current : i ih [ma] 0 2 4 6 8 6 12 18 24 30 36 supply voltage: vcc [v] stand-by current: i stby [a] -40c 25c 85c figure 2 . stand - by current vs supply voltage supply voltage : v cc [v] stand - by current : i stby [a] 0.5 1.0 1.5 2.0 6 12 18 24 30 supply voltage: vcc [v] circuit current: icc [ma] 85c 25c -40c figure 1 . supply current vs supply voltage supply voltage : v cc [v] supply current : i cc [ma] -0.5 0.0 0.5 1.0 1.5 0.8 1.2 1.6 2 input voltage: v in [v] internal logic: h/l [-] _ -40c 25c 85c -40c 25c 85c figure 3 . internal logic vs input voltage ( input threshold voltage ) input voltage : v in [v] internal logic : h/l [ -] 4/ 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp typical performance curves (reference data ) - continued 0 0.5 1 1. 5 2 0 0.5 1 1.5 2 2.5 output current: i out [a] output voltage: v cc- v out [v] -40c 25c 85 c figure 8 . output voltage vs output current (high side body diode) output current : i out [a] output voltage : v cc -v out [v] 0 0.5 1 1. 5 2 2.5 0 0.5 1 1.5 2 2.5 output current: i out [a] output voltage: v cc -v out [v] 85c 25c - 40c figure 7 . output voltage vs output current ( output high voltage) output current : i out [a] output voltage : v cc -v out [v] 0 3 6 9 4.5 5 5.5 6 supply voltage: v cc [v] internal signal: release [v] _ 85c 25c -40c figure 5. internal signal vs supply voltage (under voltage lock out) supply voltage: v cc [v] internal signal : release [v] 0 9 18 27 36 27 29 31 33 supply voltage: v cc [v] internal signal: release [v] _ 85c 25c -40c figure 6 . internal signal vs supply voltage (over voltage protection) supply voltage: v cc [v] internal signal : release [v] 5/ 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp ty pical performance curves (reference data ) - continued -0.5 0.0 0. 5 1.0 1.5 3.5 3.7 3.9 4.1 4.3 load current [a] internal logic: h/l [-] _ 85c 25c - 40c figure 9 . internal logic vs load current (over current protection, h side) 0 0.5 1 1.5 2 0 0.5 1 1.5 2 2.5 output current: i out [a] output voltage: v out [v] -40c 25c 85c figure 1 1 . output voltage vs output current (low side body diode) output current : i out [a] output voltage : v out [v] 0 0.5 1 1.5 2 0 0.5 1 1.5 2 2.5 output current: i out [a] output voltage: v out [v] 85c 25c -40c figure 1 0 . output voltage vs output current (output low voltage) output current : i out [a] output voltage : v out [v] internal logic : h/l [ -] -0.5 0.0 0.5 1.0 1.5 3.7 3.9 4.1 4.3 4.5 load current [a] internal logic: h/l [-] _ 85c 25c -40c figure 1 2 . internal logic vs load current (over current protection, l side) internal logic : h/l [ -] 6/ 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp application information 1. description of functions (1) operation modes table 1 logic table mode fin rin out1 out2 operation a l l hi -z (note) hi -z (note) stand - by (idling) b h l h l forward (out1 > out2) c l h l h reverse (out1 < out2) d h h l l brake (stop) e pwm l h pwm __________ forward (pwm control) f l pwm pwm __________ h reverse (pwm control) (note) hi - z : all output transistors are off . please note that this is the state of the connected diodes , which differs from that of the mechanical relay. mode (a) stand - by mode during s tand - by mode, all internal circuits are turned off , including the output power transistors. m otor output goes to high impedance. when the system is switched to stand - by mode while the motor is running, the system enters an idling state because of the body diodes . however, when the system switches to stand - by from any other mode ( except the brake mode ) , the control logic remains in the high state for at least 50 s before shut ting down all circuits. mode (b) forward mode this operating mode is defined as the forward rotation of the motor when the out1 pin is high and out2 pin is low. if the motor is connected between the out1 and out2 pin s , the current flows from out1 to out2. mode (c) reverse mode this operating mode is defined as the reverse rotation of the motor when the out1 pin is low and out2 pin is high . if the motor is connected between the out1 and out2 pin s , the current flows from out 2 to out 1. mode (d) brake mode this operating mode is used to quickly stop the motor (short circuit brake). it differs from the stand - by mode b ecause the internal control circuit is operat ing in the brake mode. please switch to stand - by mode (rather than the brake mode) to save power and reduce consumption. ( a) stand - by mode ( b) forward mode ( c) reverse mod e ( d) brake mode figure 13. four basic operations ( output stage ) m on off off on m off on on off m off on off on off off off off m 7/ 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp mode (e),(f) pwm control mode the rotational speed of the motor can be controlled by the duty cycle of the pwm signal fed to the fin pin or the rin pin. in this mode, the high side output is fixed and the low side output is switching , c orresponding to the input signal. the state of the output toggles between low and high impedance. the frequency of the input pwm signal can be between 20khz and 100khz. the circuit may not operate properly for pwm frequencies below 20khz and above 100khz. note that control may not be attained by swit ching on duty at frequencies lower than 20khz, since the operation functions via the stand - by mode. to operate in this mode, connect the vref pin to the vcc pin. in addition, establish a current path for the recovery current from the motor, by connect ing a bypass capacitor (10 f or higher is recommended) between vcc and ground. control input : h control input : l figure 14 . pwm control operation (output stage) figure 15. pwm control operation ( timing chart ) (2) cross- conduction protection circuit in the full bridge output stage, when the upper and lower transistors are turned on at the same time during high to low or low to high transition, a n inrush current flows from the power supply to ground, resulting to a loss . this circuit eliminates the inrush current by providing a dead time (about 400ns, nominal) during the transition . (3) output protection circuits (a) under v oltage l ock - out (uvlo) circuit to ensure the lowest power supply voltage necessary to operate the controller , and to prevent under voltage ma lfunction s , a uvlo circuit has been built into this driver . when the power supply voltage falls to 5.3v (nominal) or below , the controller forces all driver outputs to high impedance. when the voltage rises to 5.5v (nominal) or above , the uvlo circuit ends the lockout operation and returns the chip to normal operation. (b) over v oltage p rotection (ovp) c ircuit when the power supply voltage exceeds 31 v (nominal), the controller forces all driver outputs to high impedance . the ovp circuit is released and its operation ends when the voltage drops back to 29 v (nominal) or below . this protection circuit does not work in the stand - by mode. also , note that t his circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. therefore, do not continue to use the ic after this circuit is activated, and do not operate the ic in an environment where activation of the cir cuit is assumed. (c) thermal s hutdown (tsd) c ircuit the tsd circuit operates when the junction temperature of the driver exceeds the preset temperature (175 c nominal). at this time, the controller forces all driver outputs to high impedance. since thermal hy steresis is provided in the tsd circuit, the chip returns to normal operation when the junction temperature f alls below the preset temperature (150 c nominal). thus, it is a self -re setting circuit. the tsd circuit is designed only to shut the ic off to prevent thermal runawa y. it is not designed to protect the ic or guarantee its operation in the presence of extreme heat. do not continue to use the ic after the tsd circuit is activated, and do not operate the ic in an environment where activation of the circuit is assumed. m on off off on m on off off off f i n rin out1 out2 8/ 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp (d) over -c urrent p rotection (ocp) c ircuit to protect this driver ic from ground fault s , power supply line fault s and load short circuit s , the ocp circuit monitors the output current for the circuit s monitoring time (10 s, nominal) . when the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290 s, nominal). the ic returns to normal operation after the off time period has elapsed (self- retur n ing type). at the two channels type, this circuit works independently for each channel. figure 16 . over - current protection ( timing chart ) i/o equivalent circuit s figure 17. fin / rin figure 18 . out1 / out2 fin rin 100k 100k out1 out2 vcc gnd threshold iout ct rl input internal status mon itor / timer 0 off on mon. off timer on i out 9/ 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . fur thermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluct uations in the small - signal ground caused by large currents. also ensure that the ground traces of external c omponents do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line i mpedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in t emperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guarante ed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inru sh current may flow instantaneously due to the internal powering sequence and delays, especi al ly if the ic has more than one power supply. therefore, give special consideration to power coupling capaci tance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge c apacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspect ion process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the p cb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedanc e and extremely low capacitance. if left unconnected, the electric field from the outside can easily c harge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 10 / 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp operational notes C continued 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements i n order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n l ayers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substr ate) should be avoided. fig ure 19 . example of monolithic ic structure 13. area of safe operation (aso) operate the ic such that the output voltage, output current, and power diss ipation are all within the area of safe operation (aso). 14. power supply lines 2 r eturn current generated by the motor s back -emf requires countermeasures , such as providing a return current path by inserting capacitors across the power supply and gnd (10 f, ceramic capacitor is recommended) . in this case, it is important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors C including a capacitance drop at low temperatures - occurs. also, the connected power supply must have sufficient current absorbing capability. otherwise, the regenerate d current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exceeding the absolute maximum rating. to help protect against damage or degradation, physical safety measures should be t aken, such as providing a voltage clamping diode across the power supply and gnd. 15. capacitor between output and ground if a large capacitor is connected between the output pin and ground pin, current from the charged capacitor can flow into the output pin and may destroy the ic when the vcc or vin pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 10f between output and ground . 16. switching noise when the operation mode is in pwm control or vref control, pwm switching noi se may affect the control input pins and cause ic malfunctions. in this case, insert a pull down resistor (10k? is recommended) between each contr ol input pin and ground. marking diagram hrp 7 (top view) bd62222hfp part number marking lot number 1pin mark n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements 11 / 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp physical dimension, tape and reel information package name hrp7 12 / 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
data s heet bd62222hfp revision history date revision changes 14.mar.2012 001 new release 25.dec.2012 002 improved the statement in all pages. de leted status of this document in page 11. 0 9.sep .2014 003 applied the rohm standard style. improved operational notes . 13 / 13 09.sep.2014 rev.003 tsz02201 - 0p2p0b300100 -1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BD62222HFP-TR

	To Download BD62222HFP-TR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .